Precision electroplating
for microstructuring and wafer processes

In microtechnology and semiconductor manufacturing, electroplating is a key process for the controlled deposition of functional metal layers. Precise metallization of thin films forms the basis for high-performance electronic components, MEMS structures, and sensor systems.

The μGALV systems provide stable process control, high flexibility in geometries and materials, and scalable system designs for diverse requirements in development and production. Customer-specific electroplating processes with tightly controlled layer parameters can be implemented reliably.

The μGALV systems provide stable process control, high flexibility in geometries and materials, and scalable system designs for diverse requirements in development and production. Customer-specific electroplating processes with tightly controlled layer parameters can be implemented reliably.