Premium electrolytes
for electroplating applications
In addition to our electroplating systems, we offer specially developed electrolytes for precise, stable, and efficient coating processes in micro-electroplating and semiconductor technology. Our Micro Plate series is designed for maximum process reliability and reproducible coating qualities.
Our chemicals
Micro Plate Ni
A sulfamic nickel electrolyte developed for micro-electroplating applications. Ideal for producing thin, uniform nickel coatings with high precision, as well as thick layers exceeding one millimeter.
Micro Plate Cu
An acidic copper electrolyte perfectly suited for the micro-electroplating of copper layers (e.g., RDL). Provides high-quality deposits.
Micro Plate Cu-TSV
An acidic copper electrolyte optimized for micro-electroplating of copper layers in TSV applications. Aspect ratios of 10:1 and above can be achieved reliably.
Micro Plate NiFe
A stable electrolyte for the deposition of Ni-Fe alloys, including Permalloy, with an iron content of up to 55%.
Ideal for applications requiring specific magnetic properties.
Micro Plate NiP
A nickel-phosphorus electrolyte designed for deposition of nickel-phosphorus coatings with increased hardness and wear resistance.
Other electroplating solutions
Furthermore, we offer additional electroplating solutions, such as for NiW, Sn, and other metals and alloys.
Do you require customized electrolyte and process solutions?
Together, we will develop a solution precisely tailored to your coating requirements.
WOLL.GROUP
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info@m-o-t.info