μCHEM-ECES
Electrochemical etch stop

The μCHEM-ECES etch stop module is an advanced system specifically developed for electrochemical etch stop processes (ECES). It combines cost-efficient operation, ease of use, and high precision in the production of thin single-crystal silicon membranes. The process utilizes the different etching potentials of n- and p-doped silicon layers in alkaline etching solutions such as potassium hydroxide (KOH).

The modular and flexibly configurable design of the μCHEM-ECES system enables deployment in both industrial series production and research and development environments. Its modular architecture and precise process controllability make it an ideal solution for demanding etching processes in semiconductor and microsystems technology.

We work closely with you to ensure that every solution is precisely aligned with your specific technical requirements. This enables high precision, efficient processes, and reliable results in both research and high-volume production.

Data Sheet
μCHEM-ECES etch stop module

Wafer sizes: Up to 300 mm
Applications: Membranes, MEMS, CMOS, sensors, R&D or production

Single-wafer version
Overflow circulation with filtration
Potentiostat for monitoring the cell potential
Individually customizable process chamber amount and material selection
PLC-controlled

Standard: Overflow rinse
Optional: Quick Dump Rinsing (QDR), Spin Rinse Dryer (SRD)

Material: Polypro white
Piping: PFA tubing with PFA Flaretek® tube fittings
User interface: Touch panel

Automatic handling (ready for robot handling)
Internal chemical management
Carrier movement
Integration of pre-/post-processing cells
Laminar flow units (optional)
Design as fume hood
FM-4910-certified materials

All operating elements for the processes are integrated into the front panel.
All electrical and pneumatic components are integrated in a separate compartment in the rear service area.
DIW and N2 spray guns are integrated into the work surface.