μGALV-W
Wafer coating

The μGALV-W electroplating system was developed for highly precise wafer coating processes in the MEMS, semiconductor, optics and solar industries. The system is designed for use in cleanroom environments and enables stable, reproducible wafer coating up to a diameter of 300 mm.

Thanks to the modular system concept and flexible configuration options, μGALV-W can be integrated into existing production environments as well as into development and pilot processes. The focus is on stable process control, controlled layer parameters, and a reproducible process ramp-up from R&D to series production.

Our team develops custom electroplating solutions tailored to your process requirements and material systems. In our in-house application lab, we analyze and optimize processes, test configurations, and support you in selecting suitable chemicals and process parameters.

Datasheet
Wafer coating tool: μGALV-W

Wafer sizes: Up to 300 mm
Applications: Pads or contacts, redistribution layer (RDL), pillar, bumps, TSV, TGV, MEMS, 3D integration

Cleanroom compatible
Modular design
Multi-wafer compatibility
Choice of coating methods: rack plater, fountain plater or flow channel for different coating requirements

Overflow process with one process cell and one reserve tank with filtration loop
Customizable chamber configurations
Electroplating of metals: Ni, Cu, Au, Ag, In
Electroplating of alloys: NiFe, NiCo, NiW, SnPb and more
Electroless deposition: Ni, Au, SnPb and more
Flexible process cell configurations: rack plater, fountain tower or flow channel (tilted wafer rotation)
Pulse and reverse-pulse plating with a minimum pulse duration of 0.1 ms; optional complex waveforms such as sine, triangle, etc.

Standard: Overflow rinse
Optional: Quick Dump Rinsing (QDR), Spin Rinse Dryer (SRD)

Material: Polypro white
Pump: PP centrifugal pump, optional PVDF or PTFE
Filter: PP filter, optional PVDF/PFA
Piping: PP piping, optional PVDF or PFA hoses with PFA Flaretek® hose fittings
Operator interface (HMI): IPC with keyboard/monitor and PLC control
Available in Pro and R&D+ versions

Automatic handling (semi-automatic, dry-in and dry-out)
Front slide: transparent PVC material
Integration of pre- and post-processing cells
Integration of laminar flow units
Exhaust hood version available
Etching and wetting cells available (= integration of pre- and post-processing cells)
FM 4910-compliant material available on request