μCHEM
Precision for advanced wet etching processes

μCHEM is an advanced wet etching system for demanding applications in the MEMS, semiconductor, optics, and solar cell industries. It supports all common chemical process steps and, thanks to its modular and flexible design, is suitable for both industrial series production and research and development projects. This ensures reliable efficiency and precision across different areas of application.

Manufactured from high-quality polypropylene or stainless steel, the system offers high resistance to acids, bases, and solvents. At the same time, μCHEM complies with all relevant environmental regulations and is designed for safe and stable operation.

An integrated safety tray serves for the controlled retention of escaping chemicals and contributes to a safe and clean working environment.

Data Sheet
Wet Etching System μCHEM

Wafer sizes: Up to 300 mm
Applications: MEMS, CMOS, sensor, PV, R&D or production

Batch or single-wafer version
Suitable for cleaning, etching, dissolving, etc.
Individual number of chambers and material selection
PLC-controlled

Standard: Overflow rinse
Optional: Quick Dump Rinsing (QDR), Spin Rinse Dryer (SRD)

Material: White polypropylene or stainless steel
Piping: PP lines, optionally PVDF or PFA-Flaretek® pipe connections
User interface: Touch panel

Automatic handling (prepared for robot handling)
Overflow circulation with filtration
Ultrasonic or megasonic technology
Internal chemical management
Carrier movement
Front slider: Material = transparent PVC
Integration of laminar flow units
Integration of pre-/post-processing cells possible
Design as fume hood
Fire extinguisher on request
FM-4910-certified materials

All control elements for the processes are integrated in the front panel.
All electrical and pneumatic components are located in a separate area in the rear service section.
DIW and N2 spray guns are integrated into the work surface.